This week, at the 2018 IEEE International Electron Devices Meeting (IEDM), imec presents a 300mm-wafer platform for MOSFET devices with 2D materials. 2D materials could provide the path towards extreme device-dimension scaling as they are atomically precise and suffer little from short channel effects. Other possible applications of 2D materials could come from using them as switches in the BEOL, which puts an upper limit on the allowed temperature budget in the integration flow.   The imec pl...